This series of equipment is mainly used for the inspection of 2D and 3D pattern defects at the sub-micron level or higher, enabling full-type defect detection on the patterned circuit. Equipped with a versatile bright/dark illumination system and zoom lenses, it can achieve different detection accuracy and high-speed autofocus. Its application extends to highly warped wafers with large surface variations in the front-end of the line and advanced packaging.

1、Provides integrated front-side, back-side and edge inspection, at sub-micron level accuracy.

2、Flexible modular configuration optimizes utilization of both expenditure and space.

3、Supports simultaneous online high-speed data acquisition of 3 modules.

4、Combined with deep learning algorithms, to achieve highly efficient and accurate ADC (Automatic Defect Classification) .

5、Provides multi-dimensional evaluation and display of measurement result, to quickly focus on process problems.